Hello, welcome to Zhejiang Dejie Electronic Technology Co., Ltd!
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Number of layers:
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2-40
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Plate thickness:
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0.2-7.0mm
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Maximum copper thickness:
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7oz
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Size of finished product:
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650*1100mm
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Minimum line width / spacing:
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3/3mil
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Maximum plate thickness to aperture ratio:
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12:1
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Minimum mechanical drilling hole diameter:
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6mil
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Distance from hole to conductor:
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3.5mil
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Impedance tolerance(Ω):
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±5%(<50) ±10%(≥50)
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Surface treatment process:
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OSP, Chemical deposition of gold, nickel and palladium, tin deposition, silver deposition, lead-free tin spraying, hard gold plating, soft gold plating, gold finger, etc
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Material Science:
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FR-4, High Tg, halogen-free, high frequency (Rogers, Isola...), CEM, etc
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| Number of rigid / flexible layers: | 10/6 |
| Minimum line width distance: | 3/3mil |
| Thickness and aperture ratio of plate: | 12:1 |
| Distance from hole to conductor: | 6mil |
| Impedance tolerance(Ω): | 10% |
| Surface treatment process: | There are lead spray tin, chemical precipitation of gold, tin, silver, lead-free spray tin, plating hard gold, soft gold, silver paste, etc |
| 3+N+3: | Conventional production |
| Laser blind hole electroplating filling: | Conventional production |
| Minimum laser aperture: | 4mil |
| Number of layers: | 1-2L (metal substrate & metal core plate), 1-2L (ceramic DBC board) |
| Plate thickness: | 0.5-3.0mm Size: max:400*500 ,min:25*25mm |
| Machining: | X / Y / Z accuracy ± 0.08mm, horn hole, screw hole |
| Thermal conductivity of thermal conductive materials: | Conventional thermal conductive materials: 1-4W / m.k; ceramic thermal conductive materials: 24-170W / M.K |
| Maximum wiring copper thickness: | 5OZ |
| Metal surface treatment: | Aluminum ordinary oxidation, aluminum hard oxidation, aluminum chemical passivation, sand blasting, wire drawing, surface electroplating treatment |
| Surface treatment process: | Hot air leveling, chemical deposition of gold, tin, silver, electroplating soft / hard gold, etc |
簡(jiǎn)體中文
English
